장비안내
Si BEOL & GaN MPW
- 장비아이디 FS-WB10
- 장비명 Wafer Bonder System (웨이퍼 접합 시스템)
- Model SB8GEN2
- Maker Suss Microtec
- 담당자 김중헌
- 연락처 031-546-6449
- E-Mail joongheon.kim@kanc.re.kr
- 상 태 ● (가동중)
장비사양(Hardware Specification)
ㆍ 8inch Bonder[SB8GEN2]
- 8inch Wafer, Max Temp 500°C
- Bond Force 20KN
- Vacuum 1E-05mBar
ㆍ 4inch Bonder[SB6GEN2]
- 4inch Wafer, Max Temp 500°C
- Bond Force 11KN
- Vacuum 1E-04mBar
ㆍ Bond Aligner[BAGEN4]
- 8inch Wafer,
- Align Accuracy +/-2um이하
ㆍ De-Bonder[DB6S]
- 4inch Wafer, Max Temp 250°C
- Slide-off 방식
ㆍ Cleaner Module[RCD8]
- 4inch Wafer, Nozzle clean방식
- Resin Removal, IPA Clean
공정성능(Process Specification)
ㆍ 8inch Wafer Bonder
- Direct/Eutectic/Thermo-compression
- Bonding 가능 (with Pattern Align)
ㆍ 4inch Wafer Bonder
- Adhesive/Direct/Eutectic/
- Thermo-compression
- Bonding 가능 (Pattern Align불가능)
활용분야(Application)
ㆍ 차세대 패키징, 화합물 반도체, MEMS 등
ㆍ 기판 : Si, SiC, 사파이어, Glass, LT wafer 등
관련 자료
