장비안내
Si BEOL & GaN MPW
- 장비아이디 FS-EP10
- 장비명 Cu Plating Machine for Damascene
- Model Solstice S4
- Maker Class One
- 담당자 이동근
- 연락처 031-546-6322
- E-Mail dongkeun.lee@kanc.re.kr
- 상 태 ● (가동중)
적용가능한 기판 정보
O (가능) / △ (협의필요) / X (불가능)
| 기판 종류 | 기판 Size | 기판 Type | 기판 두께 | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Si | III-V | Glass | Flex | 조각 | 2" | 4" | 6" | 8" | 12" | 플랫 | 노치 | Normal | Special |
| O | X | X | X | X | X | X | O | O | X | X | O | O | X |
장비사양(Hardware Specification)
ㆍ Wafer size : 8inch, 6inch
- 8inch Notch Wafer @ SEMI Standard
- 6inch Flat @ SEMI Standard
ㆍ 2 Plating module (Cu Damascene, Cu TSV)
ㆍ Plating Mode : DC, Pulse, Reverse
ㆍ full Auto. Process : Cassette Loading → Vac. Pre-Wet → Plating → SRD → Cassette Unloading
ㆍ Wafer Rotating type
- 1 liter additive auto-dosing bottles for 1 mL dose resolution
- Semi-Auto. Bath Analyzer
공정성능(Process Specification)
ㆍ Gap Fill Minimum Pattern Size :
- Damascene : 60nm
- TSV : 1um
ㆍ Aspect Ratio : ~ 3
ㆍ Within Wafer Uniformity : <6%
ㆍ Wafer to Wafer Uniformity : <3%
활용분야(Application)
ㆍ BEOL Cu Damascene
ㆍ Cu TSV
